The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jul. 28, 2016
Applicants:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Fujitsu Frontech Limited, Inagi-shi, Tokyo, JP;

Inventors:

Takayoshi Matsumura, Yokohama, JP;

Yoshiyasu Sugimura, Inagi, JP;

Hideo Miyazawa, Inagi, JP;

Tatsuro Tsuneno, Inagi, JP;

Assignees:

FUJITSU LIMITED, Kawasaki, JP;

FUJITSU FRONTECH LIMITED, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); G06K 19/07 (2006.01); G06K 19/077 (2006.01); H01Q 1/50 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2225 (2013.01); G06K 19/0723 (2013.01); G06K 19/07754 (2013.01); H01Q 1/38 (2013.01); H01Q 1/50 (2013.01);
Abstract

A disclosed RFID tag includes a substrate; a chip bonded to the substrate with an adhesive, and including a first connection terminal on a first surface, the first surface being on a side bonded to the substrate; a first antenna wiring formed on the substrate, and electrically coupled to the first connection terminal; and an adhesive layer formed of the adhesive, and including a base portion and a filet portion, the base portion being in an area of the substrate opposed to the first surface of the chip, the filet portion being in an area of the substrate surrounding the chip. The first antenna wiring is electrically coupled to the first connection terminal via a plurality of paths at an outer edge of the filet portion of the adhesive layer.


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