The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Feb. 13, 2015
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Noriyuki Kitao, Shizuoka-ken, JP;
Hiroko Kimura, Susono, JP;
Makoto Adachi, Numazu, JP;
Keiichi Kaneko, Mishima, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Abstract
The present invention is to provide fine catalyst particles with better catalytic performance than ever before and a carbon-supported catalyst with better catalytic performance than ever before. Disclosed is a method for producing fine catalyst particles, comprising: a potential applying step of applying a potential to the fine palladium-containing particles in a first dispersion, until a peak indicating a Pd{111} surface in a reduction wave of a cyclic voltammogram becomes larger than a peak indicating a Pd{110} or Pd{100} surface in the reduction wave of the cyclic voltammogram; a copper covering step of covering at least part of the fine palladium-containing particle with copper by preparing a second dispersion by mixing the first dispersion and a copper-containing solution after the potential applying step, and applying a potential that is nobler than the oxidation-reduction potential of copper to the fine palladium-containing particles in the second dispersion; and a platinum covering step of covering at least part of the fine palladium-containing particle with platinum by mixing the second dispersion and a platinum-containing solution after the copper covering step.