The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jan. 20, 2015
Applicant:

Sumitomo Chemical Company, Limited, Tokyo, JP;

Inventors:

Gaku Yoshikawa, Osaka, JP;

Masayuki Takashima, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/52 (2010.01); H01L 23/29 (2006.01); H01L 33/56 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 23/296 (2013.01); H01L 33/56 (2013.01); H01L 33/486 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method for producing a semiconductor light-emitting device having a substrate, an element and an encapsulating material as constituent members, includes: a first step of providing the substrate with the element; a second step of potting an uncured encapsulating material onto the substrate to cover the element; and a third step of curing the potted encapsulating material in such a manner that all of the following formulae (1), (2) and (3) are satisfied when the absorbances which a cured encapsulating material having a thickness of t [nm] has at wavelengths of 380 nm, 316 nm and 260 nm are represented by Abs(t), Abs(t) and Abs(t), respectively, and the light transmittance thereof at 380 nm is represented by T(t): (1) T(1.7)≥90%; (2) Abs(t)−Abs(t)<0.011t; and (3) Abs(t)−Abs(t)<0.125t.


Find Patent Forward Citations

Loading…