The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

May. 18, 2017
Applicant:

Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;

Inventors:

Hirofumi Harada, Chiba, JP;

Keisuke Uemura, Chiba, JP;

Hisashi Hasegawa, Chiba, JP;

Shinjiro Kato, Chiba, JP;

Hideo Yoshino, Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 27/02 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0922 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/823807 (2013.01); H01L 21/823814 (2013.01); H01L 21/823828 (2013.01); H01L 21/823892 (2013.01); H01L 27/0266 (2013.01); H01L 27/0928 (2013.01); H01L 29/0847 (2013.01); H01L 29/66659 (2013.01); H01L 29/7835 (2013.01); H01L 29/0653 (2013.01); H01L 29/7833 (2013.01);
Abstract

Provided is a semiconductor integrated circuit device including a first N-channel type high withstanding-voltage MOS transistor and a second N-channel type high withstanding-voltage MOS transistor formed on an N-type semiconductor substrate, the first N-channel type high withstanding-voltage transistor including a third N-type low-concentration impurity region containing arsenic having a depth smaller than a P-type well region in a drain region within the P-type well region, and the second N-channel type high withstanding-voltage MOS transistor including a fourth N-type low-concentration impurity region that is adjacent to the P-type well region and has a bottom surface being in contact with the N-type semiconductor substrate. In this manner, the high withstanding-voltage NMOS transistors capable of operating at 30 V or higher are integrated on the N-type semiconductor substrate.


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