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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9972597 B1

PDFFull Text
Date of Patent:
May. 15, 2018

Filed:

Jul. 15, 2015

Method of bonding with silver paste

Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Kyoung-Kook Hong, Hwaseong-si, KR;

Hyun Woo Noh, Seoul, KR;

Youngkyun Jung, Seoul, KR;

Dae Hwan Chun, Gwangmyeong-si, KR;

Jong Seok Lee, Suwon-si, KR;

Su Bin Kang, Busan, KR;

Assignee:

HYUNDAI MOTOR COMPANY, Seoul, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Erin B Saad

Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 35/00 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); B23K 20/233 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 20/026 (2013.01); B23K 20/16 (2013.01); B23K 20/233 (2013.01); B23K 35/025 (2013.01); B23K 35/264 (2013.01); B23K 35/3006 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H05K 3/3463 (2013.01); B23K 2201/42 (2013.01); B23K 2203/166 (2015.10); H01L 2224/13294 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16505 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32505 (2013.01); H01L 2224/8184 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81825 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83825 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/201 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/20751 (2013.01); H05K 3/341 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer.

Find Patent Forward Citations

Hong, Kyoung-Kook. (2018). Method of bonding with silver paste (U.S. Patent No. 9972597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9972597

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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