The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Jul. 05, 2016
Applicant:
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/49838 (2013.01); H01L 24/17 (2013.01); H01L 2224/0912 (2013.01); H01L 2224/0951 (2013.01); H01L 2224/175 (2013.01); H01L 2224/1712 (2013.01);
Abstract
A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of pads disposed on the first face of the substrate, each of the plurality of pads including a first face and an opposing second face that is in contact with the first face of the substrate. The semiconductor package is further described to include a plurality of solder-on-pad structures provided on a first of the plurality of pads.