The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jun. 03, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yoshito Saito, Nagaokakyo, JP;

Yosuke Hirata, Nagaokakyo, JP;

Takashi Hiramatsu, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 29/00 (2006.01); H01G 4/005 (2006.01); H01G 4/06 (2006.01); H01G 4/20 (2006.01); H01G 4/258 (2006.01); H05K 3/46 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H05K 3/12 (2006.01); H05K 1/16 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/258 (2013.01); H01G 4/005 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H05K 3/1291 (2013.01); H05K 3/4629 (2013.01); H05K 3/4664 (2013.01); H01G 4/1209 (2013.01); H05K 1/162 (2013.01); H05K 3/1216 (2013.01);
Abstract

A method for manufacturing a laminated ceramic capacitor having a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces.


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