The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Sep. 21, 2016
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 10/00 (2006.01); H01C 13/02 (2006.01); H01C 1/14 (2006.01); H01C 17/06 (2006.01); H01G 4/40 (2006.01); H01G 2/16 (2006.01); H01C 10/50 (2006.01); H01C 17/00 (2006.01); H01F 27/40 (2006.01); H01G 5/38 (2006.01); H01L 27/02 (2006.01); H01L 27/08 (2006.01); H01F 29/00 (2006.01); H01G 5/019 (2006.01); H01L 23/525 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01C 13/02 (2013.01); H01C 1/14 (2013.01); H01C 10/50 (2013.01); H01C 17/006 (2013.01); H01C 17/06 (2013.01); H01F 27/402 (2013.01); H01F 29/00 (2013.01); H01G 2/16 (2013.01); H01G 4/40 (2013.01); H01G 5/019 (2013.01); H01G 5/38 (2013.01); H01L 23/5256 (2013.01); H01L 27/0207 (2013.01); H01L 27/0814 (2013.01); H01L 28/20 (2013.01); H01L 2224/16225 (2013.01); Y10T 29/49099 (2015.01);
Abstract
A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO, TiN, TiNO and TiSiON.