Method of wrapping mica paper on an electrical conductor and mica paper tape suitable for same

Abstract

A method is disclosed of applying a mica paper around an electrical conductor, the process including attaching the tape comprising the mica paper to the conductor at an attachment point on the conductor; winding the tape around the conductor surface until the tape has been wound to a point that is at least 25 percent of the conductor circumference from the attachment point and then initiating a continuous removal of the support layer from the tape, starting at the attachment point; the mica paper remaining in contact with the surface of the conductor; and continuing to wind the tape around the conductor while simultaneously removing the support layer at a removal point until a desired amount of conductor surface is completely covered with at least one layer of the mica paper, with the proviso that the removal point is maintained at least 25 percent of the conductor circumference behind the winding point until the desired amount of conductor surface is completely covered. A tape is also disclosed of mica paper and a support layer, wherein the mica paper; wherein the initial elongation of the support layer is equal to or less than the initial elongation of the mica paper; and wherein the support layer is demountably attached to the mica paper such that when a delamination force of 10 N/10 mm or less is imposed on the support layer it can be separated from the mica paper.