The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Oct. 10, 2013
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Yoshinobu Omori, Tokyo-to, JP;
Naonobu Yoshi, Tokyo-to, JP;
Michihiro Ogura, Tokyo-to, JP;
Tomoki Murata, Tokyo-to, JP;
Mikiko Hojo, Tokyo-to, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo-to, JP;
Abstract
The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): (Symbols in the formulae are as described in the Description.)