The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Oct. 16, 2013
Applicants:

Sumitomo Electric Industries, Ltd., Osaka-shi, JP;

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Inventors:

Akiko Inoue, Osaka, JP;

Taichiro Nishikawa, Osaka, JP;

Tetsuya Kuwabara, Osaka, JP;

Misato Kusakari, Osaka, JP;

Hiroyuki Kobayashi, Yokkaichi, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); C22C 9/00 (2006.01); C22C 9/01 (2006.01); C22C 9/02 (2006.01); C22C 9/04 (2006.01); C22C 9/06 (2006.01); C22F 1/08 (2006.01); H01B 3/44 (2006.01); H01B 7/295 (2006.01); H02G 15/02 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); C22C 9/00 (2013.01); C22C 9/01 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 9/06 (2013.01); C22F 1/08 (2013.01); H01B 3/44 (2013.01); H01B 7/295 (2013.01); H02G 15/02 (2013.01); C22F 1/00 (2013.01);
Abstract

An object of the present invention is to provide an ultrafine copper alloy being high in strength and conductivity and being also superior in elongation, a copper alloy stranded wire, a covered electric wire including the copper alloy wire or copper alloy stranded wire, and a terminal-fitted electric wire. A copper alloy wire used as a conductor, the copper alloy wire containing greater than or equal to 0.4% by mass and less than or equal to 1.5% by mass of Fe, greater than or equal to 0.1% by mass and less than or equal to 1.0% by mass of Ti, and the remainder including Cu and an impurity.


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