The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Feb. 20, 2015
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Tzong-Shii Pan, San Jose, CA (US);

Cliff Zhang, San Jose, CA (US);

Maribel Castro, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); G11B 5/29 (2006.01); G11B 5/84 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4813 (2013.01); G11B 5/295 (2013.01); G11B 5/48 (2013.01); G11B 5/486 (2013.01); G11B 5/4833 (2013.01); G11B 5/4846 (2013.01); G11B 5/4853 (2013.01); G11B 5/84 (2013.01); Y10T 29/4903 (2015.01); Y10T 29/49023 (2015.01); Y10T 29/49025 (2015.01); Y10T 29/49027 (2015.01);
Abstract

A method for head stack assembly (HSA) rework is disclosed. A first head gimbal assembly (HGA) includes a first suspension attached to an arm of the HSA, and a first flexure tail that terminates in a first bonding region that is bonded to a flexible printed circuit (FPC) of the HSA. The first HGA is removed by cutting the first bonding region from a remainder of the first flexure tail and detaching the first suspension from the arm. The first bonding region of the first flexure tail is left bonded to the FPC. A replacement HGA includes a replacement suspension and a replacement flexure tail that terminates in a second bonding region. The replacement HGA is installed on the HSA by attaching the replacement suspension to the arm, overlaying the second bonding region on the first bonding region, and bonding the second bonding region to the first bonding region.


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