The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

May. 21, 2014
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-do, KR;

Inventors:

Si Joon Song, Suwon-si, KR;

Hyuk Hwan Kim, Hwaseong-si, KR;

Hyun Jeong Kim, Hwaseong-si, KR;

Seok Hyun Nam, Seoul, KR;

Young Keun Lee, Suwon-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09F 13/04 (2006.01); G09F 13/08 (2006.01); G02F 1/1335 (2006.01); F21V 5/04 (2006.01); F21V 7/00 (2006.01); F21V 7/04 (2006.01); F21V 13/04 (2006.01); H05K 1/02 (2006.01); G02B 19/00 (2006.01); F21Y 115/10 (2016.01); F21V 23/00 (2015.01); F21V 23/04 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133611 (2013.01); F21V 5/046 (2013.01); F21V 7/0066 (2013.01); F21V 7/04 (2013.01); F21V 13/04 (2013.01); F21V 23/004 (2013.01); G02B 19/0028 (2013.01); G02B 19/0061 (2013.01); G02B 19/0071 (2013.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); H05K 1/0274 (2013.01); F21Y 2115/10 (2016.08); G02F 2001/133607 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A light source module includes a printed circuit board including a wiring layer, an insulating coating layer disposed on the wiring layer, and a reflection adjustment pattern disposed on the insulating coating layer and having reflection characteristics which are different from reflection characteristics of the insulating coating layer, a light emitting chip mounted on the printed circuit board, and an optical lens arranged on an upper portion of the light emitting chip and fixed to the printed circuit board.


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