The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Apr. 16, 2012
Applicants:

Paul Kessler Rosenberg, Sunnyvale, CA (US);

Michael Renne Ty Tan, Menlo Park, CA (US);

Sagi Varghese Mathai, Sunnyvale, CA (US);

Joseph Straznicky, Santa Rosa, CA (US);

Inventors:

Paul Kessler Rosenberg, Sunnyvale, CA (US);

Michael Renne Ty Tan, Menlo Park, CA (US);

Sagi Varghese Mathai, Sunnyvale, CA (US);

Joseph Straznicky, Santa Rosa, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12 (2013.01); G02B 6/424 (2013.01); G02B 6/425 (2013.01); G02B 6/4245 (2013.01); G02B 6/4259 (2013.01); G02B 6/4274 (2013.01); G02B 6/4279 (2013.01); G02B 6/4295 (2013.01); H01L 21/02 (2013.01); Y10T 29/41 (2015.01);
Abstract

An optical subassembly includes a thru optical via () formed through a semiconductor substrate (), an optoelectronic component () secured to the substrate () such that an active region () of the optoelectronic component is aligned with the thru optical via (), and circuitry () formed into the substrate (), the circuitry to connect to and operate in accordance with the optoelectronic component ().


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