The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 25, 2012
Applicant:

Konica Minolta, Inc., Tokyo, JP;

Inventors:

Masataka Matsuo, Hachioji, JP;

Kenji Ishida, Hino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/551 (2006.01); G01N 21/64 (2006.01); G01N 33/543 (2006.01);
U.S. Cl.
CPC ...
G01N 21/648 (2013.01); G01N 33/54373 (2013.01); G01N 2021/6417 (2013.01);
Abstract

[Problem] To provide a sensor chip for SPFS measurement, by which, irrespective of environmental conditions, fluctuations are low in characteristics such as signal, noise, or detection sensitivity, quantitative property can be ensured, and a highly precise and accurate SPFS measurement can be carried out. [Solution] A sensor chip for SPFS measurement which has a dielectric member having been produced by carrying out injection molding of a resin, when viewing from the metal thin film-formed surface side of the dielectric member and taking as b the distance of the side end surface position of the resin inlet to the position on the metal thin film-formed surface that is farthest from the side end surface position of the resin inlet, the center of a ligand immobilization part is located in the area between the 3b/8 position and the 6b/8 position from the side end surface position of the resin inlet.


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