The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Mar. 07, 2014
Applicant:

Tsmc Solid State Lighting Ltd., Hsinchu, TW;

Inventors:

Chih-Hsuan Sun, Kaohsiung, TW;

Wei-Yu Yeh, Tainan, TW;

Hsueh-Hung Fu, Hsinchu, TW;

Dong Jung Suen, Guishan, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60Q 1/06 (2006.01); F21K 99/00 (2016.01); F21V 3/04 (2018.01); F21V 7/00 (2006.01); B05D 5/06 (2006.01); F21V 29/74 (2015.01); F21V 29/77 (2015.01); F21K 9/20 (2016.01); F21K 9/232 (2016.01); F21K 9/60 (2016.01); F21K 9/66 (2016.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/50 (2013.01); B05D 5/061 (2013.01); B05D 5/063 (2013.01); F21K 9/20 (2016.08); F21K 9/232 (2016.08); F21K 9/60 (2016.08); F21K 9/66 (2016.08); F21V 3/049 (2013.01); F21V 3/0445 (2013.01); F21V 3/0472 (2013.01); F21V 7/0016 (2013.01); F21V 29/74 (2015.01); F21V 29/773 (2015.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08);
Abstract

The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.


Find Patent Forward Citations

Loading…