The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jun. 15, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Benjamin Paul Lacy, Greer, SC (US);

Srikanth Chandrudu Kottilingam, Simpsonville, SC (US);

Carlos Miguel Miranda, Greer, SC (US);

Gary Michael Itzel, Simpsonville, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01D 5/18 (2006.01); F01D 9/04 (2006.01); F01D 25/12 (2006.01); F01D 5/14 (2006.01); F01D 5/28 (2006.01);
U.S. Cl.
CPC ...
F01D 5/187 (2013.01); F01D 5/147 (2013.01); F01D 5/186 (2013.01); F01D 9/041 (2013.01); F01D 25/12 (2013.01); F01D 5/288 (2013.01); F05D 2220/32 (2013.01); F05D 2240/122 (2013.01); F05D 2240/304 (2013.01); F05D 2240/305 (2013.01); F05D 2240/306 (2013.01); F05D 2260/202 (2013.01); F05D 2260/204 (2013.01); Y02T 50/672 (2013.01); Y02T 50/676 (2013.01);
Abstract

A hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface defines an interior space. The outer surface defines a pressure side surface and a suction side surface. The pressure and suction side surfaces are joined together at a leading edge and at a trailing edge. A first cooling passage is formed in the suction side surface of the substrate. It is coupled in flow communication to the interior space. A second cooling passage, separate from the first cooling passage, is formed in the pressure side surface. The second cooling passage is coupled in flow communication to the interior space. A cover is disposed over at least a portion of the first and second cooling passages. The interior space channels a cooling fluid to the first and second cooling passages, which channel the cooling fluid therethrough to remove heat from the component.


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