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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9969914 B1

PDFFull Text
Date of Patent:
May. 15, 2018

Filed:

Sep. 08, 2014

Microcapsule type curable resin composition

Applicant:

Threebond Fine Chemical Co., Ltd, Sagamihara-Shi, Kanagawa, JP;

Inventors:

Tomohiro Onoda, Tokyo, JP;

Kunihiko Kamata, Tokyo, JP;

Yasuo Maeda, Tokyo, JP;

Assignee:

THREEBOND FINE CHEMICAL CO., LTD., Kanagawa, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Kara B Boyle

Int. Cl.
CPC ...
C08G 59/00 (2006.01); C09J 163/00 (2006.01); C08F 2/00 (2006.01); C08F 2/44 (2006.01); C09J 133/14 (2006.01); C08G 59/18 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08F 2/20 (2006.01); C09J 4/06 (2006.01); F16B 39/22 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08F 2/00 (2013.01); C08F 2/20 (2013.01); C08F 2/44 (2013.01); C08G 59/188 (2013.01); C08G 59/245 (2013.01); C08G 59/50 (2013.01); C08L 63/00 (2013.01); C09J 4/06 (2013.01); C09J 133/14 (2013.01); F16B 39/225 (2013.01); C08K 3/34 (2013.01); C08K 3/346 (2013.01); C08K 3/36 (2013.01); C08K 2201/003 (2013.01); C08K 2201/014 (2013.01);
Abstract

A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 μm, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 μm, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

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