The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Jun. 25, 2014
Applicant:
Mitsubishi Engineering-plastics Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 69/00 (2006.01); C08K 3/22 (2006.01); C08K 3/40 (2006.01); C08L 67/02 (2006.01); C08L 101/00 (2006.01); B32B 15/08 (2006.01); H01B 1/02 (2006.01); C23C 18/20 (2006.01); C23C 18/31 (2006.01); C08K 3/10 (2006.01); C08K 3/14 (2006.01); C08K 3/34 (2006.01); C08L 25/00 (2006.01); C09D 177/06 (2006.01); C08L 77/06 (2006.01); C23C 18/12 (2006.01); C23C 18/16 (2006.01); C08K 3/08 (2006.01); C08K 7/14 (2006.01); H04M 1/02 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
C08L 69/00 (2013.01); B32B 15/08 (2013.01); C08K 3/08 (2013.01); C08K 3/10 (2013.01); C08K 3/22 (2013.01); C08K 3/34 (2013.01); C08K 3/346 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08L 25/00 (2013.01); C08L 67/02 (2013.01); C08L 77/06 (2013.01); C08L 101/00 (2013.01); C09D 177/06 (2013.01); C23C 18/1237 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/204 (2013.01); H01B 1/02 (2013.01); H04M 1/0202 (2013.01); B32B 2457/00 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/0893 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/2296 (2013.01); C08K 2201/014 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/06 (2013.01); C23C 18/38 (2013.01);
Abstract
Provided is a resin composition having higher platability. The resin composition contains at least two kinds of metals and also containing a conductive oxide having a resistivity of 5×10Ω·cm or less.