The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 19, 2013
Applicants:

Javier E. Gonzalez, East Amherst, NY (US);

Arthur F. Grant, Amherst, NY (US);

Inventors:

Javier E. Gonzalez, East Amherst, NY (US);

Arthur F. Grant, Amherst, NY (US);

Assignee:

PRAXAIR TECHNOLOGY, INC., Danbury, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 8/24 (2006.01); C03C 10/00 (2006.01); C04B 37/00 (2006.01); B01D 65/00 (2006.01); B01D 71/02 (2006.01); C04B 35/626 (2006.01); C04B 35/632 (2006.01); C04B 35/634 (2006.01); C04B 35/638 (2006.01); C04B 37/02 (2006.01); H01M 8/0282 (2016.01); H01M 8/0286 (2016.01);
U.S. Cl.
CPC ...
C03C 8/24 (2013.01); B01D 65/003 (2013.01); B01D 71/024 (2013.01); C03C 10/0018 (2013.01); C04B 35/6264 (2013.01); C04B 35/632 (2013.01); C04B 35/638 (2013.01); C04B 35/6342 (2013.01); C04B 37/005 (2013.01); C04B 37/025 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2237/10 (2013.01); C04B 2237/348 (2013.01); C04B 2237/40 (2013.01); C04B 2237/401 (2013.01); C04B 2237/60 (2013.01); C04B 2237/708 (2013.01); C04B 2237/765 (2013.01); H01M 8/0282 (2013.01); H01M 8/0286 (2013.01); Y10T 403/477 (2015.01);
Abstract

An improved method of sealing a ceramic part to a solid part made of ceramic, metal, cermet or a ceramic coated metal is provided. The improved method includes placing a bond agent comprising an AlOand SiObased glass-ceramic material and organic binder material on adjoining surfaces of the ceramic part and the solid part. The assembly is heated to a first target temperature that removes or dissolves the organic binder material from the bond agent and the assembly is subjected to a second induction heating step at a temperature ramp rate of between about 100° C. and 200° C. per minute to temperatures where the glass-ceramic material flows and wets the interface between adjoining surfaces. The assembly is rapidly cooled at a cooling rate of about 140° C. per minute or more to induce nucleation and re-crystallization of the glass-ceramic material to form a dense, durable and gas-tight seal.


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