The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 01, 2017
Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventors:

Arlynn W. Smith, Blue Ridge, VA (US);

Dan Chilcott, Buchanan, VA (US);

Assignee:

Eagle Technology, LLC, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/62 (2006.01); B81B 7/00 (2006.01); H01J 31/12 (2006.01); H01J 29/00 (2006.01); H01J 29/18 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); B81B 7/0038 (2013.01); H01J 29/003 (2013.01); H01J 31/12 (2013.01); B81B 2201/047 (2013.01); H01J 29/18 (2013.01); H01J 2229/0046 (2013.01);
Abstract

An improved microelectromechanical device includes an upper plate, a lower plate, and a spacing structure. The upper plate includes a first surface and an opposite second surface. The lower plate is spaced from the upper plate. The lower plate includes a third surface that faces the first surface of the upper plate and a fourth surface that is opposite of the third surface. The lower plate also includes a series of structures disposed with the third surface of the lower plate. The spacing structure is coupled to the upper and lower plate. The spacing structure includes a base portion that is sealed to the first surface of the upper plate and the third surface of the lower plate. The spacing structure further includes a protrusion that extends from the base portion between the upper and lower plates.


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