The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2018
Filed:
Nov. 15, 2016
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Hiroyuki Masubuchi, Matsumoto, JP;
Hironori Maekawa, Matsumoto, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 11/70 (2006.01); B26F 1/44 (2006.01); B26F 1/24 (2006.01); B31D 1/02 (2006.01); B41J 3/407 (2006.01); B41J 11/66 (2006.01); B65C 9/44 (2006.01); B26F 1/38 (2006.01);
U.S. Cl.
CPC ...
B41J 11/70 (2013.01); B26F 1/24 (2013.01); B26F 1/44 (2013.01); B31D 1/026 (2013.01); B31D 1/027 (2013.01); B41J 3/4075 (2013.01); B41J 11/663 (2013.01); B65C 9/44 (2013.01); B26F 2001/388 (2013.01);
Abstract
A label die cutting device enables easily changing the shape of the die cut made in label paper. A printerhas a print unitand a die cutting process unit(label die cutting device). The die cutting process unithas a conveyance pathfor conveying the label paper, a die cutting unit including wire pinsand a wire pin drive mechanismfor advancing and retracting the wire pins, and a die cutting controllerfor driving the wire pin drive mechanismto strike the wire pinsagainst the label paperon the conveyance pathand die cut the label paperbased on print data. The die cutting unit is a wire dot head