The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Dec. 09, 2015
Applicant:

Washington State University, Pullman, WA (US);

Inventors:

Rahul P. Panat, Pullman, WA (US);

Deuk H. Heo, Pullman, WA (US);

Assignee:

Washington State University, Pullman, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); G06F 1/16 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01G 4/12 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/14 (2006.01); H05K 3/22 (2006.01); H05K 3/46 (2006.01); H01G 4/002 (2006.01); B22F 3/00 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); H05K 1/16 (2006.01); B33Y 80/00 (2015.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B22F 3/008 (2013.01); G06F 1/163 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/0206 (2013.01); H01F 41/046 (2013.01); H01G 4/002 (2013.01); H01G 4/1218 (2013.01); H01P 11/001 (2013.01); H05K 1/028 (2013.01); H05K 1/0283 (2013.01); H05K 1/0296 (2013.01); H05K 1/0313 (2013.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 3/14 (2013.01); H05K 3/22 (2013.01); H05K 3/4644 (2013.01); B22F 1/0018 (2013.01); B22F 2003/1058 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); C22C 2202/02 (2013.01); H05K 1/165 (2013.01); H05K 2201/0162 (2013.01);
Abstract

Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.


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