The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 2018

Filed:

Jul. 08, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Andrew Batton Witney, Schenectady, NY (US);

Jeffrey Michael Breznak, Waterford, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 5/10 (2006.01); B22F 7/06 (2006.01); B23K 35/02 (2006.01); B23K 26/342 (2014.01); B23K 26/00 (2014.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B22F 5/00 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B22F 5/10 (2013.01); B22F 7/06 (2013.01); B23K 26/0081 (2013.01); B23K 26/342 (2015.10); B23K 35/0222 (2013.01); B23K 35/0238 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3033 (2013.01); B23K 35/362 (2013.01); B23K 35/3603 (2013.01); B23K 35/3605 (2013.01); B23K 35/3606 (2013.01); B23K 35/3611 (2013.01); B22F 5/009 (2013.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12); Y02P 10/295 (2015.11);
Abstract

A method of fabricating a joining preform includes the step of printing a self-fluxing joining alloy. Joining includes brazing and soldering. The self-fluxing joining alloy contains at least one of phosphorus, boron, fluorine, chlorine, or potassium. Another printing step prints a non-phosphorous joining alloy. Both printing steps are performed by an additive manufacturing or 3D printing process. The printing a self-fluxing joining alloy step may be repeated until the non-phosphorous joining alloy is substantially encapsulated by the self-fluxing joining alloy. The self-fluxing joining alloy may be a BCuP alloy, a CuP alloy, a CuSnP alloy, a CuSnNiP alloy or a CuAgP alloy. The non-phosphorous joining alloy may be a BAg alloy, a BNi alloy or a BAu alloy.


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