The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jan. 15, 2015
Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Hitoshi Sakamoto, Tokyo, JP;

Minoru Yoshikawa, Tokyo, JP;

Mahiro Hachiya, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0266 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H05K 7/20136 (2013.01); H05K 7/20327 (2013.01); H05K 7/20409 (2013.01); H05K 7/20436 (2013.01); H05K 7/20809 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A cooling deviceincludes a first heat receiving unit, a second heat receiving unit, a first heat dissipating unit, and a second heat dissipating unit. The first heat dissipating unitand the second heat dissipating unithave a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surfacethat is a principal surface having a flat plate shape in the first heat dissipating unitand a second principal surfacethat is a principal surface having a flat plate shape in the second heat dissipating unitare arranged so as to face to each other. As a result, the size of the cooling devicecan be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.


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