The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Nov. 21, 2016
Applicants:
Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, Jiangsu, CN;
Lite-on Technology Corporation, Taipei, TW;
Inventors:
I-Chen Chien, Keelung, TW;
Shih-Chang Hsu, Taipei, TW;
Assignees:
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Changzhou, Jiangsu Province, CN;
LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/22 (2010.01); H01L 33/24 (2010.01); H01L 33/00 (2010.01); H01L 33/10 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0079 (2013.01); H01L 33/10 (2013.01); H01L 33/24 (2013.01); H01L 33/502 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A method for manufacturing a light emitting diode structure uses a removable prefilled layer to attach the flip-type chip on a temporary substrate. A growth substrate of the flip-type chip is removed by laser lift-off, and then the light emitting diode structure is attached to a transparent support body. Lastly, the temporary substrate and the prefilled layer are removed.