The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jun. 05, 2017
Applicant:

National Taiwan University of Science and Technology, Taipei, TW;

Inventors:

Bohr-Ran Huang, Taipei, TW;

Jinn Chu, Taipei, TW;

You-Syuan Chen, Taipei, TW;

Chia-Hao Chang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/108 (2006.01); H01L 31/0296 (2006.01); H01L 31/0392 (2006.01); H01L 31/0352 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1085 (2013.01); H01L 31/0296 (2013.01); H01L 31/022408 (2013.01); H01L 31/03925 (2013.01); H01L 31/035227 (2013.01);
Abstract

An ultraviolet sensor comprises a glass substrate, a semiconductor structure, an electrode layer and a thin film metallic glass. The semiconductor structure comprises a semiconductor seed layer formed on the glass substrate and a plurality of semiconductor nanostructures formed on the semiconductor seed layer. The electrode layer is formed between the semiconductor seed layer and the plurality of semiconductor nanostructures. The thin film metallic glass is in contact with the semiconductor structure, wherein an interface between the thin film metallic glass and the semiconductor structure forms a Schottky barrier junction to inhibit dark current and increase signal-to-noise ratio.


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