The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Apr. 01, 2016
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Fang-Chang Hsueh, Taichung, TW;

Yu-Min Lin, New Taipei, TW;

Chih-Hao Lin, Taipei, TW;

Tzong-Liang Tsai, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); F21K 9/23 (2016.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); F21V 3/00 (2015.01); F21V 8/00 (2006.01); H01L 33/58 (2010.01); F21Y 101/00 (2016.01); H01L 33/36 (2010.01); F21Y 105/16 (2016.01); F21K 9/232 (2016.01); F21Y 115/10 (2016.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); F21K 9/23 (2016.08); F21V 3/00 (2013.01); G02B 6/0073 (2013.01); H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/58 (2013.01); F21K 9/232 (2016.08); F21Y 2101/00 (2013.01); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08); H01L 33/36 (2013.01); H01L 33/486 (2013.01);
Abstract

A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.


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