The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

May. 20, 2016
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Hongro Lee, Yongin-si, KR;

Chunghwan Lee, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1285 (2013.01); H01L 21/02675 (2013.01); H01L 27/1222 (2013.01);
Abstract

A laser annealing apparatus includes: a substrate supporting unit which supports a substrate; a laser beam irradiating unit which irradiates a line laser beam extending in a first direction to an amorphous silicon layer provided on the substrate on the substrate supporting unit; a substrate moving unit which moves the substrate supporting unit in a second direction crossing the first direction; and a first beam cutter and a second beam cutter, which are disposed between the substrate supporting unit and the laser beam irradiating unit, where the first and second beam cutters move to increase or decrease a shielded area of the substrate, which is an area of the substrate overlapping the first or second beam cutter and the line laser beam, to shield from at least a portion of the line laser beam irradiated to a portion of the substrate at an outer portion of the amorphous silicon layer.


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