The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Dec. 15, 2015
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor package may be provided. The semiconductor package may include a substrate. The semiconductor package may include a first semiconductor chip flip-chip bonded to a first surface of the substrate. The semiconductor package may include second semiconductor chips respectively flip-chip bonded to portions of the first surface of the substrate adjacent to both ends of the first semiconductor chip. The semiconductor package may include a third semiconductor chip solder-jointed to the first surface of the substrate covering the first semiconductor chip and portions of the second semiconductor chips.