The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Apr. 18, 2017
Applicant:

The Goverment of the United States of America, As Represented BY the Secretary of the Navy, Washington, DC (US);

Inventors:

Scott A. Mathews, Takoma Park, MD (US);

Iyoel Beniam, Washington, DC (US);

Alberto Piqué, Crofton, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 21/4828 (2013.01); H01L 21/76885 (2013.01); H01L 24/05 (2013.01); H01L 24/43 (2013.01); H01L 24/85 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/435 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/4814 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/8585 (2013.01);
Abstract

A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.


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