The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Nov. 23, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Shin Soyano, Shiojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/047 (2006.01); H01L 23/367 (2006.01); H01L 25/07 (2006.01); H02M 7/537 (2006.01); H02M 7/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/047 (2013.01); H01L 23/367 (2013.01); H01L 23/48 (2013.01); H01L 24/49 (2013.01); H01L 25/072 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H01L 25/18 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14253 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device includes a plurality of main terminals extending from one end of a base plate toward the other end thereof, a group of semiconductor chips on a side of higher electric potential disposed on one side of the main terminal and mounted on the base plate, and a group of semiconductor chips on a side of lower electric potential disposed on the other side of the main terminal and mounted on the base plate. The one main terminal has an extending portion extending, in a direction perpendicular to the extending direction of the main terminal, toward one of both sides of the main terminal, and two adjacent semiconductor chips in one of the group of semiconductor chips on the side of higher electric potential and the group of semiconductor chips on the side of lower electric potential are axisymmetrically disposed with respect to the extending portion.


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