The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Mar. 11, 2013
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi-ken, JP;
Inventors:
Assignee:
TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 29/0657 (2013.01); H01L 33/62 (2013.01); H05K 1/111 (2013.01); H05K 3/325 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13386 (2013.01); H01L 2224/1415 (2013.01); H01L 2224/16105 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/85385 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/351 (2013.01); H05K 2201/098 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10106 (2013.01); Y02P 70/611 (2015.11);
Abstract
A solid-state device includes a metal pattern formed on a substrate, a conductive bump connected to the metal pattern so as to be contact with a side surface of the metal pattern, and a solid-state element connected to the metal pattern via the conductive bump. A bottom surface level of at least a portion of the conductive bump is substantially equal to a bottom surface level of a portion of the metal pattern at which the metal pattern is connected to the conductive bump.