The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Jul. 26, 2017
Renesas Electronics Corporation, Tokyo, JP;
Fukumi Shimizu, Gunma, JP;
Haruhiko Harada, Gunma, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
Reliability of a semiconductor device is improved. A method for manufacturing the semiconductor device includes the steps of: providing a lead frame having a semiconductor chip mounted thereon; providing a heat radiating frame having a heat radiating plate; and resin sealing the semiconductor chip and the heat radiating plate with the lead frame and the heat radiating frame in a stacked state. The method further includes the steps of: separating a frame body of the heat radiating frame from the lead frame having a sealing body; and applying an inspection to detect resin-unfilled regions to the lead frame having the sealing body. Since the frame body of the heat radiating frame shielding an inspection region is removed before the inspection, it becomes possible to perform the inspection using transmitted light.