The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jun. 18, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Keisuke Aramaki, Tochigi, JP;

Atsuya Yoshinari, Tochigi, JP;

Takuhiro Ishii, Tochigi, JP;

Shin-ichi Uchida, Tochigi, JP;

Masahiko Ito, Tochigi, JP;

Syunsuke Uchida, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/48 (2006.01); C09K 5/14 (2006.01); B29C 47/00 (2006.01); B29C 47/88 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); B29C 47/0004 (2013.01); B29C 47/0019 (2013.01); B29C 47/0021 (2013.01); B29C 47/0066 (2013.01); B29C 47/8805 (2013.01); C09K 5/14 (2013.01); H01L 21/4871 (2013.01); H01L 23/373 (2013.01); H01L 23/3733 (2013.01); B29C 2035/0822 (2013.01); B29K 2995/0013 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.


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