The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Aug. 31, 2016
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Manabu Takakuwa, Tsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 7/00 (2006.01); B65B 35/50 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 27/1157 (2017.01); H01L 27/11578 (2017.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/67259 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/1157 (2013.01); H01L 27/11578 (2013.01);
Abstract

According to one embodiment, deposition supporting system, depositing apparatus and manufacturing method of a semiconductor device includes a depositing apparatus that deposits stacked bodies on wafers allocated to stations and a host computer. The host computer evaluates feature amounts convertible to misalignments at predetermined points on the stacked bodies of the respective wafers, and specifies the stations to which the wafers are to be allocated based on the feature amounts of the stacked bodies in the respective stations. The depositing apparatus allocates the wafers to the stations based on the specification from the host computer.


Find Patent Forward Citations

Loading…