The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jun. 27, 2016
Applicant:

Newport Fab, Llc, Newport Beach, CA (US);

Inventors:

David J. Howard, Irvine, CA (US);

Michael J. DeBar, Tustin, CA (US);

Paul D. Hurwitz, Irvine, CA (US);

Assignee:

New Fab, LLC, Newport Beach, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/00 (2006.01); H01L 21/762 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); H01L 21/304 (2013.01); H01L 21/30604 (2013.01); H01L 21/84 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01);
Abstract

A method of forming a semiconductor structure is disclosed. The method includes forming a semiconductor wafer having a device layer situated over a handle substrate, the device layer having at least one semiconductor device, forming a front side glass on a front side of the semiconductor wafer, and partially removing the handle substrate from a back side of the semiconductor wafer. The method also includes removing a portion of the semiconductor wafer from an outer perimeter thereof, either by sawing an edge trim trench through the handle substrate, the device layer and into the front side glass to form a ring, and removing the ring on the outer perimeter of the semiconductor wafer, or by edge grinding the outer perimeter of the semiconductor wafer. The method further includes completely removing the handle substrate.


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