The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

May. 20, 2015
Applicant:

Eryn Smith, Pleasanton, CA (US);

Inventor:

Eryn Smith, Pleasanton, CA (US);

Assignee:

DIABLO CAPITAL, INC., Reno, NV (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/3065 (2013.01); H01L 21/6833 (2013.01); H01L 21/78 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1062 (2015.01); Y10T 156/1064 (2015.01);
Abstract

A mobile electrostatic carrier (MESC) provides a structural platform to temporarily bond a semiconductive wafer and can be used to transport the semiconductive wafer or be used to perform manufacturing processes on the semiconductive wafer. The MESC uses a plurality of electrostatic field generating (EFG) circuits to generate electrostatic fields across the MESC that allow the MESC to bond to compositional impurities within the semiconductive process. The MESC is particularly useful during singulation for a wafer fabrication process. The MESC holds the semiconductive wafer in a constant position as the semiconductive wafer is cut into a plurality of dies. Once the MESC is discharges its EFG circuits and consequently dissipates its bonding electrostatic fields, the plurality of dies can be easily and readily removed from the MESC.


Find Patent Forward Citations

Smith, Eryn. (2018). Mobile electrostatic carrier for a semiconductive wafer and a method of using thereof for singulation of the semiconductive wafer (U.S. Patent No. 9966294). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9966294

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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