The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Feb. 22, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, KR;

Inventors:

Youn-Soo Seo, Suwon-Si, KR;

Myung-Sam Kang, Hwaseong, KR;

Jin-Soo Kim, Seoul, KR;

Young-Gwan Ko, Seoul, KR;

Woon-Chul Choi, Goyang, KR;

In-Seok Kim, Suwon-Si, KR;

Hye-Yeon Cha, Yongin, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/255 (2006.01); H01F 17/00 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/0013 (2013.01); H01F 27/324 (2013.01); H01F 41/046 (2013.01); H01F 2017/048 (2013.01);
Abstract

Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.


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