The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Jun. 10, 2014
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 3/30 (2006.01); H01B 3/44 (2006.01); H05K 3/10 (2006.01); H01P 3/08 (2006.01); H01P 3/00 (2006.01); H01P 3/06 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0216 (2013.01); H01B 3/305 (2013.01); H01B 3/306 (2013.01); H01B 3/445 (2013.01); H01P 3/00 (2013.01); H01P 3/082 (2013.01); H01P 3/088 (2013.01); H05K 3/103 (2013.01); H01P 3/06 (2013.01); H05K 1/0237 (2013.01); H05K 1/0298 (2013.01);
Abstract
The present invention provides an insulated coated wire comprising a wire, a wire coating layer disposed around the wire, and a wire adhesive layer disposed around the wire coating layer, wherein the wire coating layer is of one type of or a combination of two or more types of a fluorine resin, a polyamide-imide resin and a low dielectric polyimide resin having a relative permittivity of less than 3.6 at 10 GHz, and a multi-wire wiring board using the insulated coated wire.