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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9966163 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Sep. 10, 2014

Electric contact material for connector and method for producing same

Applicants:

Autonetworks Technologies, Ltd., Yokkaichi-shi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventor:

Shigeru Sawada, Yokkaichi, JP;

Assignees:

AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;

SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

Attorney:

Oliff PLC

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/00 (2006.01); H01B 1/02 (2006.01); C25D 5/12 (2006.01); C25D 7/00 (2006.01); H01R 13/03 (2006.01); C25D 3/12 (2006.01); C25D 3/22 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); C25D 5/10 (2006.01); C25D 5/50 (2006.01); C22C 9/02 (2006.01); C25D 5/34 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); C25D 3/12 (2013.01); C25D 3/22 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 5/505 (2013.01); C25D 7/00 (2013.01); H01R 13/03 (2013.01); C22C 9/02 (2013.01); C25D 5/34 (2013.01); Y10T 428/1259 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12667 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01);
Abstract

An electric contact material for a connector includes a base material made of a metal material; an alloy layer that is formed on the base material and made of an alloy containing at least three elements including Sn and Cu as well as at least one metal selected from Zn, Co, Ni, and Pd; and a conductive coating layer formed on the surface of the alloy layer. The alloy layer contains an intermetallic compound obtained by replacing some of the Cu atoms in CuSnwith at least one metal selected from Zn, Co, Ni, and Pd. It is preferable that the content of at least one metal selected from Zn, Co, Ni, and Pd in the alloy layer is in a range of 1 to 50 atom % when the total content of the metal and Cu is regarded as 100 atom %.

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