The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Nov. 10, 2014
Osaka University, Osaka, JP;
Beamsense Co., Ltd., Osaka, JP;
Takashi Suzuki, Osaka, JP;
Sueki Baba, Osaka, JP;
OSAKA UNIVERSITY, Osaka, JP;
BEAMSENSE Co., Ltd., Osaka, JP;
Abstract
A void evaluation apparatus in a solder includes an evaluation function calculation unit for calculating a solder evaluation function by using a pixel value pi contained in the voids that is set to 1 and the pixel value pi not contained in the voids is 0 for each pixel constituting an image in the solder, and by using a weight function w(ri), which is maximum at a solder center (ri=0), and is 0 at a maximum radius (ri=r) for a distance ri from the solder center. The apparatus further has a void evaluation unit for evaluating that the influence of voids is larger as the evaluation function is relatively larger for the each solder.