The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jul. 20, 2016
Applicant:

Ut-battelle, Llc, Oak Ridge, TN (US);

Inventors:

David B. Geohegan, Knoxville, TN (US);

Christopher M. Rouleau, Knoxville, TN (US);

Kai Wang, Oak Ridge, TN (US);

Kai Xiao, Knoxville, TN (US);

Ming-Wei Lin, Guilderland, NY (US);

Alexander A. Puretzky, Knoxville, TN (US);

Masoud Mahjouri-Samani, Knoxville, TN (US);

Assignee:

UT Battelle, LLC, Oak Ridge, TN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/337 (2006.01); G03F 1/20 (2012.01); H01L 21/033 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/24 (2006.01); H01L 29/735 (2006.01); H01L 29/778 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
G03F 1/20 (2013.01); H01L 21/02568 (2013.01); H01L 21/02664 (2013.01); H01L 21/0332 (2013.01); H01L 29/0661 (2013.01); H01L 29/24 (2013.01); H01L 29/1606 (2013.01); H01L 29/735 (2013.01); H01L 29/778 (2013.01);
Abstract

Methods, articles of manufacture and systems for creating new nanoscale two dimensional materials comprising designed arrays of lateral or vertical heterojunctions may be fabricated by first lithographically masking a 2D material. Exposed, or unmasked, regions of the 2D material may be converted to a different composition of matter to form lateral or vertical heterojunctions according to the patterned mask. PLD and high kinetic energy impingement of atoms may replace or add atoms in the exposed regions, and a plurality of the exposed regions may be converted concurrently. The process may be repeated one or more times on either side of the same 2D material to form any suitable combination of lateral heterojunctions and/or vertical heterojunctions, comprising semiconductors, metals or insulators or any suitable combination thereof. Furthermore, the resulting 2D material may comprise p-n, n-n, p-p, n-p-n and p-n-p junctions, or any suitable combination thereof.


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