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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9964635 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Nov. 29, 2013

Production method for ultrasonic probe, ultrasonic probe, and ultrasonic diagnosis device

Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Shuntaro Machida, Tokyo, JP;

Akifumi Sako, Tokyo, JP;

Taiichi Takezaki, Tokyo, JP;

Yasuhiro Yoshimura, Tokyo, JP;

Tatsuya Nagata, Tokyo, JP;

Naoaki Yamashita, Tokyo, JP;

Hiroki Tanaka, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:

Miles & Stockbridge P.C.

Primary Examiner:

Daniel Pihulic

Int. Cl.
CPC ...
G01S 7/52 (2006.01); A61B 8/00 (2006.01); B81C 1/00 (2006.01); B06B 1/02 (2006.01); G01S 15/89 (2006.01);
U.S. Cl.
CPC ...
G01S 7/52079 (2013.01); A61B 8/4444 (2013.01); A61B 8/4494 (2013.01); B06B 1/0292 (2013.01); B81C 1/00301 (2013.01); G01S 15/8915 (2013.01); A61B 8/54 (2013.01);
Abstract

Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.

Find Patent Forward Citations

Machida, Shuntaro. (2018). Production method for ultrasonic probe, ultrasonic probe, and ultrasonic diagnosis device (U.S. Patent No. 9964635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9964635

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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