The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2018
Filed:
Apr. 28, 2017
Applicant:
Nxp B.v., Eindhoven, NL;
Inventor:
Mark Isler, Hamburg, DE;
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/22 (2006.01); G01R 33/09 (2006.01); H01L 43/14 (2006.01); H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/00 (2006.01); G01R 33/00 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
G01R 33/093 (2013.01); G01R 33/0052 (2013.01); G01R 33/09 (2013.01); G01R 33/098 (2013.01); H01L 27/22 (2013.01); H01L 43/00 (2013.01); H01L 43/02 (2013.01); H01L 43/04 (2013.01); H01L 43/06 (2013.01); H01L 43/065 (2013.01); H01L 43/08 (2013.01); H01L 43/14 (2013.01); H01L 43/12 (2013.01);
Abstract
According to embodiments there is provided a magneto-resistive sensor module. The sensor module may comprise: an integrated circuit; magneto-resistive sensor elements arranged as a bridge circuit monolithically integrated on the integrated circuit; and a stress buffer layer arranged between the integrated circuit and the magneto-resistive sensor element. There is also a provided a method of manufacturing the magneto-resistive sensor module.