The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Jan. 07, 2016
Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Andrew S. Auyeung, Ottawa, CA;

Michael J. Craven, Kanata, CA;

Huu Dang, Ottawa, CA;

Harvey Hum, Ottawa, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2015.01); F21V 29/71 (2015.01); F21V 8/00 (2006.01); F21V 29/502 (2015.01); F21V 29/80 (2015.01); F21V 29/76 (2015.01); F21V 29/89 (2015.01); F21V 29/70 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/713 (2015.01); F21V 29/004 (2013.01); F21V 29/502 (2015.01); F21V 29/70 (2015.01); F21V 29/71 (2015.01); F21V 29/767 (2015.01); F21V 29/80 (2015.01); F21V 29/89 (2015.01); G02B 6/0008 (2013.01); G02B 6/0096 (2013.01); F21Y 2115/10 (2016.08);
Abstract

An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.


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