The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

May. 07, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hans-Juergen Eickelmann, Mainz, DE;

Thorsten Muehge, Mainz, DE;

Erik Rueger, Mainz, DE;

Markus Schmidt, Mainz, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/54 (2006.01); C23C 14/02 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3464 (2013.01); C23C 14/027 (2013.01); C23C 14/3407 (2013.01); C23C 14/3492 (2013.01); C23C 14/54 (2013.01); C23C 14/542 (2013.01); C23C 14/545 (2013.01); C23C 14/548 (2013.01); H01J 37/32935 (2013.01); H01J 37/3429 (2013.01); H01J 37/3473 (2013.01);
Abstract

Embodiments relate to a sputter chamber comprising both a target surface and an anode surface. The sputter chamber has both an ingress and an egress to allow passage of a gas. The sputter chamber further includes a target substrate. A secondary material flexibly changes the composition of the target substrate in-situ by changing coverage of the target by the secondary material. Gas entering the sputter chamber interacts with the changed composition of the target. The interaction discharges a plasma alloy and the alloy condenses on the anode surface in the sputter chamber. The condensed alloy produces an alloy film.


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