The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Aug. 29, 2016
Applicant:

Posco, Pohang-si, KR;

Inventors:

Il-Ryoung Sohn, Gwangyang-si, KR;

Dae-Chul Bae, Pohang-si, KR;

Heung-Yun Kim, Gwangyang-si, KR;

Assignee:

POSCO, Pohang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/40 (2006.01); C23C 2/28 (2006.01); C23C 2/12 (2006.01); C22C 38/32 (2006.01); C22C 38/06 (2006.01); C22C 38/04 (2006.01); C22C 38/02 (2006.01); C22C 38/00 (2006.01); C22C 38/28 (2006.01); B32B 15/01 (2006.01); C21D 9/46 (2006.01); C21D 8/02 (2006.01); C22F 1/043 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); B32B 15/012 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22F 1/043 (2013.01); C23C 2/12 (2013.01); C23C 2/285 (2013.01); C23C 2/40 (2013.01); Y10T 428/1275 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12764 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract

Provided is a hot press-formed (HPF) member with excellent powdering resistance at the time of press forming. The HPF member includes a hot-dip coating layer containing Al on a surface of a base steel sheet. The base steel sheet includes, based on wt %, 0.18-0.25% of C, 0.1-1.0% of Si, 0.9-1.5% of Mn, 0.03% or less of P, 0.01% or less of S, 0.01-0.05% of Al, 0.05-0.5% of Cr, 0.01-0.05% of Ti, 0.001-0.005% of B, 0.009% or less of N, the balance Fe, and the other impurities. The hot-dip coating layer comprises a soft diffusion layer and a hard alloy layer. The alloy layer has a Tau phase in the range of 10-30%, in terms of area percent.


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