The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2018

Filed:

Nov. 24, 2015
Applicant:

Orbital Atk, Inc., Dulles, VA (US);

Inventor:

Robert S. Larson, Harrisville, UT (US);

Assignee:

Orbital ATK, Inc., Plymouth, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); B32B 37/12 (2006.01); C09J 163/00 (2006.01); B32B 7/12 (2006.01); H05K 1/02 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); C09J 5/00 (2013.01); C09J 163/00 (2013.01); H05K 1/0296 (2013.01); B32B 2250/02 (2013.01); B32B 2255/26 (2013.01); B32B 2307/202 (2013.01); B32B 2307/304 (2013.01); B32B 2457/00 (2013.01); B32B 2605/18 (2013.01); C09J 2463/00 (2013.01);
Abstract

An assembly comprising a first article, a second article adjacent the first article, and an electrically conductive adhesive in electrical communication with the first article and the second article. The electrically conductive adhesive comprises nickel nanostrands dispersed in a matrix comprising a reaction product of bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent. The electrically conductive adhesive exhibits a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm. Electrically conductive adhesives including nickel nanostrands, precursor packages of the electrically conductive adhesive, related methods of forming the electrically conductive adhesive and an assembly including the electrically conductive adhesive are also disclosed.


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