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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9963587 B1

PDFFull Text
Date of Patent:
May. 08, 2018

Filed:

Jul. 16, 2013

Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device

Applicant:

Nagase Chemtex Corporation, Osaka-shi, Osaka, JP;

Inventors:

Yukari Kouno, Tatsuno, JP;

Katsushi Kan, Tatsuno, JP;

Assignee:

NAGASE CHEMTEX CORPORATION, Osaka, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/68 (2006.01); C08G 59/42 (2006.01); H01L 21/52 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); C08G 59/24 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/42 (2013.01); C08G 59/4223 (2013.01); C08G 59/4238 (2013.01); C08G 59/686 (2013.01); H01L 21/52 (2013.01); H01L 23/293 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); C08G 2190/00 (2013.01); C08L 2203/206 (2013.01); H01L 21/563 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01);
Abstract

There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

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